Electronic component manufacturing method for automobile, involves electrically connecting electronic parts to conductor track structure by connecting medium, and processing connecting medium at temperature of less than preset value

摘要

The method involves applying electronic parts (14, 16, 18, 20) on a conductor track structure (12) of an injection-molded circuit carrier (10). The electronic parts are electrically connected to the conductor track structure by a connecting medium e.g. lead-free low temperature solder and conductive adhesive. The connecting medium is processed at temperature of less than 190 degree Celsius. The connecting medium is selectively applied by a dosing feeder in the area of the conductor track structure. The circuit carrier is designed as a molded interconnect device and made of plastic.