| 摘要 |
A surface-mounting type electronic circuit unit of the invention includes pedestal bases (8), which are attached to first lands (4) provided on the bottom surface of an insulating substrate (1) and are made of plate-shaped metal material having a solder film on the outer surface thereof, and solder bumps (9) provided to second lands (5). Since the pedestal bases (8) used as the mounting reference of the insulating substrate (1) is formed in a plate shape and is placed on the same plane as the first lands (4) and the mother board (11), the contact state between the first lands (1) and the mother board (11) is effectively stabilized. In addition, since the solderable amount is more than that of a conventional invention, the solder is not detached due to an impact. |
