| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing agent and a polishing method allowing efficient and uniform polishing at high speed without scratch and also allowing easy process management in the CMP technology of smoothening an interlayer dielectric film, BPSG film, and insulation film for shallow trench isolation. <P>SOLUTION: This invention relates to the CMP polishing agent containing cerium oxide particles, a dispersing agent, and a water-soluble polymer and water, wherein the water-soluble polymer is a polymer obtained in polymerization of a monomer containing at least one of a carboxylic acid having an unsaturated double bond and the salt thereof by using at least one of a cationic azo compound and the salt thereof as a polymerization initiator. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
