| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate dividing device capable of reducing manufacturing cost and dividing a substrate at high accuracy, and a method of manufacturing an electronic part. <P>SOLUTION: A first fixing part 31 clamps the substrate 1 by a second fixing part 32 while making an end edge coincident with a division groove 12. Furthermore, a pressing part 33 presses the substrate 1 along the division groove 12 at an opposite side of the first fixing part 31 with the division groove 12 as a border. An end edge of the second fixing part 32 is deviated from the end edge of the first fixing part 31 to the pressing part 33 side. Since the end edge of the first fixing part 31 is made coincident with the division groove 12, a starting point of breaking serves as a bottom of the division groove 12. By this, since the end edge of the second fixing part 32 is deviated from the end edge of the first fixing part 31 to the pressing part 33 side, a fulcrum of a bend of the substrate is deviated and a breaking direction becomes linear. Thereby, an end point of breaking reaches a position almost immediately below the division groove. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
