A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern.
申请公布号
WO2011028700(A3)
申请公布日期
2011.05.26
申请号
WO2010US47306
申请日期
2010.08.31
申请人
SAINT-GOBAIN ABRASIVES, INC.;SAINT-GOBAIN ABRASIFS;WU, JIANHUI;HALL, RICHARD W. J.;SCHULZ, ERIC M.;RAMANATH, SRINIVASAN
发明人
WU, JIANHUI;HALL, RICHARD W. J.;SCHULZ, ERIC M.;RAMANATH, SRINIVASAN