PROCESS FOR PRODUCING SOLDER POWDER

摘要

A process for producing a solder powder is provided by which it is possible to efficiently obtain a solder powder having an average particle diameter of 0.05 µm or larger but less than 3 µm in a stable yield. The process for producing a solder powder comprises: a step in which a solid or liquid metal, a nonaqueous solvent, and balls for pulverization that have a diameter of 0.05-5 mm are introduced into a vessel to obtain a mixture; a step in which the mixture is heated to a temperature between (melting point of the metal)-5ºC and (melting point of the metal)+20ºC and stirred; a step in which the balls for pulverization are separated from the stirred mixture to obtain a mixture of a solder powder and the nonaqueous solvent; and a step in which the mixture of a solder powder and the nonaqueous solvent is subjected to solid-liquid separation to obtain the solder powder.