SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

Disclosed is a semiconductor device which is provided with an interlayer insulating film (16) that includes a plurality of holes. The interlayer insulating film (16) is a film having a single layer structure. In the interlayer insulating film (16), the diameters of the holes included in a lower surface region and the diameters of the holes included in an upper surface region are smaller than the diameters of the holes included in the center region between the upper region and the lower region.