发明名称 |
LED PACKAGE, LED PACKAGE ARRAY AND BACKLIGHT UNIT |
摘要 |
<p>PURPOSE: A light emitting diode package, a light emitting diode array using the same, and a backlight unit are provided to reduce manufacturing costs by decreasing the number of LED packages by a wide orientation angle. CONSTITUTION: An LED chip(10) is settled on a substrate(1). A reflector(20) surrounds the LED chip and includes a main window(21) and a sub window(22) which emit light from the LED chip to the front. The sub window horizontally emits partial light. A molding unit(30) is filled in the reflector to seal the LED chip.</p> |
申请公布号 |
KR101037507(B1) |
申请公布日期 |
2011.05.26 |
申请号 |
KR20100002844 |
申请日期 |
2010.01.12 |
申请人 |
HEESUNG ELECTRONICS CO., LTD. |
发明人 |
YOO, HEE JONG |
分类号 |
H01L33/48;H01L33/52;H01L33/60 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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