发明名称 LED PACKAGE, LED PACKAGE ARRAY AND BACKLIGHT UNIT
摘要 <p>PURPOSE: A light emitting diode package, a light emitting diode array using the same, and a backlight unit are provided to reduce manufacturing costs by decreasing the number of LED packages by a wide orientation angle. CONSTITUTION: An LED chip(10) is settled on a substrate(1). A reflector(20) surrounds the LED chip and includes a main window(21) and a sub window(22) which emit light from the LED chip to the front. The sub window horizontally emits partial light. A molding unit(30) is filled in the reflector to seal the LED chip.</p>
申请公布号 KR101037507(B1) 申请公布日期 2011.05.26
申请号 KR20100002844 申请日期 2010.01.12
申请人 HEESUNG ELECTRONICS CO., LTD. 发明人 YOO, HEE JONG
分类号 H01L33/48;H01L33/52;H01L33/60 主分类号 H01L33/48
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