| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device with a high degree of freedom of layout of an external terminal, and a method of manufacturing a highly reliable electronic module. <P>SOLUTION: The semiconductor device includes: a semiconductor substrate 10; a plurality of first external terminals 20 having a first resin projection 23 provided to a first region 17 of a first surface 13 and a first wiring layer 25 provided partially on the first resin projection 23; and a plurality of second external terminals 30 having a second resin projection 33 provided to a second region 18 of the first surface 13 and a second wiring layer 35 provided partially on the second resin projection 33, wherein the number of the first external terminals 20 is larger than that of the second external terminals 30, and a height of the first resin projection 23 from the first surface 13 is larger than the height of the second resin projection 33 from the first surface 13. <P>COPYRIGHT: (C)2011,JPO&INPIT |
