| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device such that a joining state of a plurality of GV (Ground/Voltage) solder bumps connected to one GV plane in common and corresponding lands for the GV solder bumps is easily confirmed. <P>SOLUTION: A package substrate includes GV BGA balls for connecting lands 254 for solder bumps corresponding to the GV solder bumps arranged at an outer peripheral part of a semiconductor chip to external circuits one to one. Consequently, it can be confirmed through general continuity inspection whether or not a joining state of the GV solder bumps arranged at the outer peripheral part of the semiconductor chip and the lands 255 for the GV solder bumps corresponding to the GV solder bumps is good on the package substrate. As a result, it can be confirmed whether a joining state of all GV solder bumps of the semiconductor chip and all lands 255 for solder bumps on the package substrate 20 is good or not. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
