发明名称 CONDUCTIVE PLASTIC OVERMOLD ON SHIELDED PLASTIC WINDOW
摘要 An integrated assembly is provided for installation on a housing for electronic components. The integrated assembly includes a shielded window and a bezel overmolded onto the shielded window in an injection molding process. Since both the shielded window and the bezel have EMI resistant properties, the assembly represents an efficient method for providing high quality EMI shielding while eliminating the use of costly parts and assembly procedures.
申请公布号 WO2011063194(A1) 申请公布日期 2011.05.26
申请号 WO2010US57363 申请日期 2010.11.19
申请人 PARKER HANNIFIN CORPORATION;FINLEY, MATTHEW;PERKINS, JOHN;TOROK, PETER, Z.;FOSTER, ROBERT, H.;COWPERTHWAIT, ROBERT;BESWICK, JOHN, H.;INMAN, DAVID 发明人 FINLEY, MATTHEW;PERKINS, JOHN;TOROK, PETER, Z.;FOSTER, ROBERT, H.;COWPERTHWAIT, ROBERT;BESWICK, JOHN, H.;INMAN, DAVID
分类号 H05K9/00 主分类号 H05K9/00
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