| 摘要 |
A silicone resin for sealing a semiconductor chip. A cured silicone resin, which is obtained by curing the silicone resin at a given temperature, has a percent elongation, after fracture, measured at a room temperature, not less than 4% of a penetration number at room temperature. A semiconductor device sealed with the silicone resin, when subjected to a heat cycle or a vibration test, provides resistance to cracking, forming of voids, and interfacial peeling-off. The cured silicone resin may have a penetration number not less than 10 and not more than 80 and a loss elasticity not less than 17% of the storage elasticity. A resin member made of the cured silicone resin and sealing a semiconductor chip may include a filler, such as silica or alumina, having a coefficient of linear thermal expansion lower than that of the cured silicone resin. |
