SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME

摘要

An improved semiconductor package includes thermal tape placed over a top side of a die that is attached to a substrate with an underfill material. The tape extends to the substrate. The tape deforms with heat and entraps the die and underfill material. Air bubbles are trapped between the tape and the die and underfill material. The tape can be weighted and lined with an adhesive material. The tape aids in preventing the die from cracking due to mishandling.