HEAT DISSIPATION DEVICE, IN PARTICULAR FOR COMPONENTS WHICH ARE VERTICAL AND/OR OF COMPLEX SHAPE

摘要

The invention relates to a heat dissipation device (1) for a component mounted on an electronic circuit board (20), including: a hollow body having a cylindrical or right-angled prismatic shape, consisting of a first material arranged vertically above the electronic circuit board (20), the useful volume of the body including at least the component, and a resin consisting of a second material, at least partially filling the inner volume of the body so as to contain the component. The heat dissipation device can be arranged on an intermediate insulating element (22), and the resin can be introduced in the liquid state.