<p>A deposition inhibitor composition includes two compatible solvents. The first solvent has a vapor pressure of at least 10 mm Hg at room temperature and the second solvent has a vapor pressure of less than that of the first solvent. The composition further includes a hydrophilic deposition inhibitor material that is dissolved in the composition. This material is soluble in an aqueous solution that comprises at least 50% by weight of water and has a free acid content of less than 2.5 meq/g. This composition is useful to provide a deposition inhibitor pattern for chemical vapor deposition methods such as an atomic-layer-deposition method for forming a patterned thin film includes applying a hydrophilic deposition inhibitor material to a substrate.</p>
申请公布号
WO2011063065(A1)
申请公布日期
2011.05.26
申请号
WO2010US57133
申请日期
2010.11.18
申请人
EASTMAN KODAK COMPANY;LEVY, DAVID, HOWARD;ZWADLO, GREGORY, L.