发明名称 HEAT PUMP
摘要 PURPOSE: A heat pump is provided to increase the flow rate of refrigerants circulating in a heat exchanger by injecting vapor refrigerants among multiple compression chambers. CONSTITUTION: A heat pump comprises a main circuit, a first refrigerant injection line(52) and a second refrigerant injection line(62). The main circuit comprises a rotary compression unit(10), a condenser(20), expansion units(30,40), and an evaporator(70). The rotary compression unit comprises multiple compression chambers(11,12,14). The condenser condenses refrigerants passing through the rotary compression unit. The expansion units throttle the refrigerants passing through the condenser. The evaporator evaporates the refrigerants. The first refrigerant injection line is branched between the condenser and the evaporator. The refrigerants are injected into one compression chamber through the first refrigerant injection line. The second refrigerant injection line is branched between the condenser and the evaporator.
申请公布号 KR20110054816(A) 申请公布日期 2011.05.25
申请号 KR20090111603 申请日期 2009.11.18
申请人 LG ELECTRONICS INC. 发明人 CHIN, SIM WON;LEE, EUNG YUL;KO, YOUNG HWAN;PARK, SANG KYOUNG
分类号 F25B30/02;F04C18/00;F25B41/06;F25B43/00 主分类号 F25B30/02
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