| 摘要 |
PURPOSE: A substrate processing apparatus and a substrate processing method are provided to improve the process uniformity of a substrate surface by supplying plasma with uniform density to the substrate surface. CONSTITUTION: A housing(111) has an inner space. A support plate(120) is located in the inner space. The substrate is loaded on the support plate. A baffle(160) faces the support plate and includes a spray hole for spraying gas or plasma. The upper surface of the support plate is larger than the lower side of the baffle and has a different height according to the region.
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