Microscopic structure packaging method and device with packaged microscopic structure

摘要

A method of packaging a micro electro-mechanical structure (122) comprises forming said structure (122) on a substrate (100); depositing a sacrificial layer (130) over said structure (122); patterning the sacrificial layer (130); depositing a SIPOS (semi-insulating polycrystalline silicon) layer (140) over the patterned sacrificial layer (130); treating the SIPOS layer (140) with an etchant to convert the SIPOS layer into a porous SIPOS layer, removing the patterned sacrificial layer (130) through the porous layer SIPOS (140) to form a cavity (150) including said structure (122); and sealing the porous SIPOS layer (140). A device including such a packaged micro electro-mechanical structure (122) is also disclosed.