发明名称 Printed circuit board, light emitting apparatus having the same and manufacturing method thereof
摘要 <p>A printed circuit board (10) capable of improving reliability, a light emitting apparatus having the same and a manufacturing method thereof are disclosed. The printed circuit board (10) mounted with a light emitting device package (50) includes a first metal layer (12), an insulating layer (14) disposed on the first metal layer (12), a second metal layer (16) disposed on the insulating layer (14), and a mounting groove (40) for mounting the light emitting device package (50), which has a depth reaching at least an upper surface of the first metal layer (12).</p>
申请公布号 EP1937041(B1) 申请公布日期 2011.05.25
申请号 EP20070123640 申请日期 2007.12.19
申请人 LG ELECTRONICS INC.;LG INNOTEK CO., LTD. 发明人 KIM, YONG SUK;SEO, BU WAN;HUR, HOON
分类号 H01L33/62;H05K1/02;H01L33/64;H05K1/18 主分类号 H01L33/62
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