发明名称 |
Printed circuit board, light emitting apparatus having the same and manufacturing method thereof |
摘要 |
<p>A printed circuit board (10) capable of improving reliability, a light emitting apparatus having the same and a manufacturing method thereof are disclosed. The printed circuit board (10) mounted with a light emitting device package (50) includes a first metal layer (12), an insulating layer (14) disposed on the first metal layer (12), a second metal layer (16) disposed on the insulating layer (14), and a mounting groove (40) for mounting the light emitting device package (50), which has a depth reaching at least an upper surface of the first metal layer (12).</p> |
申请公布号 |
EP1937041(B1) |
申请公布日期 |
2011.05.25 |
申请号 |
EP20070123640 |
申请日期 |
2007.12.19 |
申请人 |
LG ELECTRONICS INC.;LG INNOTEK CO., LTD. |
发明人 |
KIM, YONG SUK;SEO, BU WAN;HUR, HOON |
分类号 |
H01L33/62;H05K1/02;H01L33/64;H05K1/18 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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