| 摘要 |
<p>PURPOSE: A photoelectric conversion device is provided to reduce defects due to foreign materials in a chamfering process by chamfering the edges after a bonding process. CONSTITUTION: A photo electrode is formed on a light receiving substrate(110). An opposite substrate(120) faces the light receiving substrate and includes an opposite electrode. A semiconductor layer is formed on the photo electrode and absorbs photosensitive dye excited with light. An electrolyte layer is interposed between the semiconductor layer and the opposite electrode. A chamfered side is formed on the light receiving substrate and the opposite substrate along the edge of the surface toward the outside.</p> |
