发明名称 SUBSTRATE MODULE AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.</p>
申请公布号 EP2326155(A1) 申请公布日期 2011.05.25
申请号 EP20090815968 申请日期 2009.06.02
申请人 SHARP KABUSHIKI KAISHA 发明人 SHIOTA, MOTOJI;NAGAOKA, GEN;UMEKAWA, ICHIRO;HIDA, YASUHIRO;SHIMIZU, YUKIO
分类号 H05K3/32;G02F1/1345;H01L21/60;H05K1/14;H05K3/36 主分类号 H05K3/32
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