THIN FILM DEPOSITION APPARATUS

摘要

PURPOSE: An apparatus for depositing a thin film is provided to improve efficiency by implementing both an atomic layer depositing method and a chemical vapor depositing method. CONSTITUTION: A chamber includes a space for depositing a substrate. A susceptor is rotatably installed on the space of the chamber. A raw gas sprayer(200a-200d) has N valves which control gas supplied to each gas supply pipe. A plurality of purge gas sprayers(101-104) are connected to the purge gas supply pipe in which a purge valve is installed. The controller controls the N valves and purge valves to deposit a thin film on the substrate with CVD(Chemical Vapor Deposition) or ALD(Atomic Layer Deposition).