发明名称 Laser annealing for 3-D chip integration
摘要 A laser annealing method for annealing a stacked semiconductor structure having at least two stacked layers is disclosed. A laser beam is focused on a lower layer of the stacked layers. The laser beam is then scanned to anneal features in the lower layer. The laser beam is then focused on an upper layer of the stacked layers, and the laser beam is scanned to anneal features in the upper layer. The laser has a wavelength of less than one micrometer. The beam size, depth of focus, energy dosage, and scan speed of the laser beam are programmable. Features in the lower layer are offset from features in the upper layer such that these features do not overlap along a plane parallel to a path of the laser beam. Each of the stacked layers includes active devices, such as transistors. Also, the first and second layers may be annealed simultaneously.
申请公布号 US7947599(B2) 申请公布日期 2011.05.24
申请号 US20080018756 申请日期 2008.01.23
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHEN HOWARD H.;HSU LOUIS C.;MOK LAWRENCE S.;SCOTT J. CAMPBELL
分类号 H01L21/44 主分类号 H01L21/44
代理机构 代理人
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