发明名称 Positive resist composition for immersion exposure and pattern-forming method using the same
摘要 A positive resist composition for immersion exposure comprising: (A) a resin having an alicyclic hydrocarbon structure, wherein the resin is capable of increasing a solubility of the resin (A) in an alkaline developer by an action of an acid; and (B) a compound capable of generating an acid upon irradiation with one of an actinic ray and radiation, wherein the resin (A) includes a component having a molecular weight of 1,000 or less in an area ration of 20% or less to an entire area in a pattern area by gel permeation chromatography, and a pattern-forming method using the same.
申请公布号 US7947421(B2) 申请公布日期 2011.05.24
申请号 US20060335735 申请日期 2006.01.20
申请人 FUJIFILM CORPORATION 发明人 KANDA HIROMI
分类号 G03F7/004;G03F7/30 主分类号 G03F7/004
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