MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a printed circuit board is provided to form uniform circuit patterns using an electroplating operation by separating a via-forming operation and the electroplating operation. CONSTITUTION: A seed layer is formed on one side of a base substrate(S110). A via-hole passing through the seed layer is formed on the base substrate(S120). A via-fill in connection with the seed layer is formed by filling a conductive material in the via-hole(S130). A circuit pattern is formed by implementing an electroplating operation using the seed layer as an electrode(S140).