发明名称 |
Method of manufacturing wafer level package including coating and removing resin over the dicing lines |
摘要 |
The present invention relates to a method of manufacturing a wafer level package including the steps of: preparing a substrate wafer including a plurality of pads formed on a bottom surface, a plurality of chips positioned on a top surface, and dicing lines for dividing the chips; forming external connection units on the pads; coating resin on the dicing lines by positioning masks on the substrate wafer to expose only the dicing lines; removing the masks; encapsulating the chips positioned between the resin by coating the chips with encapsulant; removing the resin coated on the dicing lines; and cutting a wafer level package along the dicing lines exposed by removing the resin into units.
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申请公布号 |
US7947530(B2) |
申请公布日期 |
2011.05.24 |
申请号 |
US20090453273 |
申请日期 |
2009.05.05 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM JIN GU;KWEON YOUNG DO;JEON HYUNG JIN;PARK SEUNG WOOK;LEE HEE KON;MOON SEON HEE |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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