发明名称 Semiconductor device and method for manufacturing same
摘要 In a semiconductor device 10 including a structure where transfer electrodes 2a to 2c are disposed on a semiconductor substrate 1 via an insulation layer 3, a first semiconductor region 4 of a first conductivity type, a second semiconductor region 5 of a conductivity type opposite to the first conductivity type, and a third semiconductor region 6 of the first conductivity type in a position that overlaps a region of the semiconductor substrate 1 directly underneath the transfer electrodes 2a to 2c. The second semiconductor region 5 is formed on the first semiconductor region 4. The third semiconductor region 6 is formed on the second semiconductor region 5 so that a position of a maximal point 8 of electric potential of the second semiconductor region 5 when being depleted is deeper than a position of the maximal point 8 in a case where the third semiconductor region 6 does not exist.
申请公布号 US7948048(B2) 申请公布日期 2011.05.24
申请号 US20050570658 申请日期 2005.12.14
申请人 PANASONIC CORPORATION 发明人 KURODA TAKAO
分类号 H01L31/06;H01L27/148;H04N5/335;H04N5/357;H04N5/369;H04N5/372;H04N5/374 主分类号 H01L31/06
代理机构 代理人
主权项
地址