| 发明名称 |
Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| 摘要 |
A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90°, cracks do not occur in the base material.
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| 申请公布号 |
US7947332(B2) |
申请公布日期 |
2011.05.24 |
| 申请号 |
US20050630651 |
申请日期 |
2005.06.22 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TAKANO NOZOMU;TAKEUCHI KAZUMASA;MASUDA KATSUYUKI;TANAKA MASASHI;OBATA KAZUHITO;OOYAMA YUUJI;MATSUURA YOSHITSUGU |
| 分类号 |
B05D3/12 |
主分类号 |
B05D3/12 |
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