发明名称 |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
摘要 |
An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.
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申请公布号 |
US7947157(B2) |
申请公布日期 |
2011.05.24 |
申请号 |
US20060494997 |
申请日期 |
2006.07.28 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
RAVKIN MIKE;BOYD JOHN;DORDI YEZDI N.;REDEKER FRED C.;DE LARIOS JOHN M. |
分类号 |
C25D5/06;C25D5/02;C25D5/04;C25D5/22;C25D7/12;C25D17/12;C25D17/14;H01L21/00;H01L21/288 |
主分类号 |
C25D5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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