| 摘要 |
<p>PURPOSE: An underfill resin composition adding a ferroelectric filler, a semiconductor package using the same, and a method for packaging the semiconductor are provided to overcome the weak conductivity due to the filler stacked in a bonding part of a bump electrode and a substrate using the underfill composition and a physical characteristic of a packaging process. CONSTITUTION: An underfill resin(100) including a filler(110) coated with a ferroelectric material(112) is coated on a substrate(200). A bump electrode(310) and an electrode pad(210) of the substrate are compressed by arranging the semiconductor chip with the bump electrode on the substrate. The compressed substrate and semiconductor chip are interposed to a jig(400) and the current is applied to the jig. The underfill resin is hardened by applying the heat and the pressure.</p> |
