LIGHT EMITTING DIODE PAKCAGE

摘要

PURPOSE: A light emitting diode package is provided to drive a light emitting device with an AC power source by serially connecting a plurality of light emitting cells. CONSTITUTION: A dielectric layer is located between a substrate(51) and a nitride semiconductor laminate structure. A metal layer(61) is located between the substrate and the nitride semiconductor laminate structure and is contacted with the lower side of the nitride semiconductor laminate structure. A molding member covers the nitride semiconductor laminate structure. Conductive materials pass through the substrate to be electrically connected to the metal layer. The upper side of the nitride semiconductor laminate structure includes the upper side of an N type nitride semiconductor layer(55). The lower side of the nitride semiconductor laminate structure includes the lower side of a P type nitride semiconductor layer(59) and the exposed lower side of the N type nitride semiconductor layer.