| 摘要 |
Disclosed is a method for manufacturing a circuit board, wherein an insulating layer and a metal film layer having excellent uniformity and excellent adhesion to the insulating layer can be efficiently formed, and laser workability during blind via formation by laser is excellent. Also disclosed are a film with a metal film and an adhesive film with a metal film, each of which is used in the method. A film with a metal film having a plastic film layer, a mold-releasing layer formed on the plastic film layer, and a metal film layer formed on the mold-releasing layer, said film with a metal film being characterized in that at least a side of the mold-releasing layer that is in contact with the metal film layer is composed of one or more water-soluble resins selected from water-soluble cellulose resins, water-soluble polyester resins and water-soluble acrylic resins, and in that the water-soluble resins contain one or more substances selected from metal compound powders, carbon powders, metal powders and black dyes, or alternatively, an adhesive film with a metal film wherein a curable resin composition layer is formed on the metal film layer of the film with a metal film is used. |
