ETCHANT COMPOSITION FOR FORMING COPPER INTERCONNECTS

摘要

The present invention relates to a wet etchant composition to a multilayer film comprising a copper-based metal layer and a titanium-based metal layer. The etchant composition of the present invention provides an excellent etching profile in case of etching said multilayer film, and minimizes the damage of a glass substrate and a lower insulating layer and the generation of residue, thereby enabling the stable performance of a subsequent process.