发明名称 PACKAGE HOUSING AND PACKAGE STRUCTURE OF EDGE-LIGHT TYPE LIGHT EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a package housing and a package structure of an edge-light type light emitting element, which have improved light emission efficiency by directly emitting the majority of a light beam. <P>SOLUTION: The package housing 20 of the edge-light type light-emitting element includes a substrate 22 and a sidewall 27. The sidewall 27 forms a cup-shaped storage space together with the substrate 22, an inner surface of the sidewall has reflectivity and is tilted from inside to outside of the sidewall to form an included angle of 140 to 150&deg;, and a projection surface is formed at an opening end of the sidewall, the area of the projection surface being 1.5 to 2 times as large as the area of a bottom of the storage space. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011101019(A) 申请公布日期 2011.05.19
申请号 JP20100249692 申请日期 2010.11.08
申请人 ADVANCED OPTOELECTRONIC TECHNOLOGY INC 发明人 CHIN SHIMEI
分类号 H01L33/60 主分类号 H01L33/60
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