| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for baking a resist, for reducing the time required for baking and enhancing the process ability while preventing coating defects such as coating irregularity and foaming, in baking (PAB: post applied bake) after application of a resist in the manufacture of a photomask. <P>SOLUTION: When heating and drying a resist film 2 after applying the resist on a photomask substrate 1, heating is carried out by a hot plate 10 to the lower face of the substrate and by near IR rays K2 to a light-shielding layer or a halftone layer 1b on the upper face of the substrate. The apparatus includes a hot plate that mounts a substrate and heats the lower face of the photomask, and a near IR source unit 20 that heats the upper face of the substrate from the upside of the substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
