| 摘要 |
An element mounted device comprising a substrate with a pedestal and a convex portion whose height is lower than the pedestal on the surface, and a first element mounted on the pedestal and fixed to the substrate by a first AuSn solder. And a part between the area of the first element opposing to the convex portion and the convex portion, is filled with a second AuSn solder which is Au-richer than the first AuSn solder.
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