ELECTRONIC PART, ELEMENT PACKAGE, AND MANUFACTURING METHOD THEREOF

摘要

Provided are an electronic part and an element package having high airtightness, wherein processes are made to be simple and productivity is improved in the manufacturing method thereof. The electronic part has an element and a package that houses the element. The package comprises a ceramic substrate, a lid body, and a connection member that connects the ceramic substrate and the lid body. A section of the lid body that joins together with the connection member is comprised of metal, the connection member is comprised of a metal having aluminum as its main ingredient, and is joined directly together with the ceramic substrate, and the element is anchored to the ceramic substrate or the lid body.