| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board high in connection strength between solder and a base material, and capable of preventing solder from being broken, and electrical connection between the solder and an electrode from becoming incomplete. SOLUTION: This wiring board includes: a plate-like base material 11 having an insulation property; a hole 11B formed by being recessed from one surface 11A of the base material 11 in the thickness direction of the base material 11, and having an inner surface intersecting the surface 11A; and an electrode 12 having a connection surface 12A for connecting spherical solder thereto and arranged in the bottom 11D of the hole 11B. The inner surface includes: first inner surfaces 13 formed by being tilted with respect to a surface direction of the connection surface 12A; and second inner surfaces 14 formed at positions different from those of the first inner surfaces 13 in the circumferential direction of the hole 11B, and having surface-side contours 11C located on relatively outer sides in the radial direction of the hole 11B relative to the surface-side contours 11C located at positions of the first inner surfaces 13, out of the surface-side contours 11C located in boundaries between the hole 11B and the surface 11A. COPYRIGHT: (C)2011,JPO&INPIT
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