发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a planar support structure having a cavity; forming a terminal within the cavity with the terminal coplanar with the planar support structure; forming a conductive pathway on the terminal and the planar support structure with the conductive pathway having a route portion and an interconnect attach portion at the end of the route portion; connecting a device and the interconnect attach portion with the interconnect attach portion towards the device; and forming an encapsulation over the planar support structure covering the conductive pathway and the device.
|
申请公布号 |
US2011115065(A1) |
申请公布日期 |
2011.05.19 |
申请号 |
US20090618417 |
申请日期 |
2009.11.13 |
申请人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;ILAGAN ALLAN P;CABLAO PHILIP LYNDON |
发明人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;ILAGAN ALLAN P.;CABLAO PHILIP LYNDON |
分类号 |
H01L23/52;H01L21/60 |
主分类号 |
H01L23/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|