发明名称 |
ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ENCAPSULATING PACKAGE |
摘要 |
The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.
|
申请公布号 |
US2011114840(A1) |
申请公布日期 |
2011.05.19 |
申请号 |
US200913054251 |
申请日期 |
2009.01.28 |
申请人 |
|
发明人 |
YAMAZAKI TAKAO;SANO MASAHIKO;KURASHINA SEIJI;SOGAWA YOSHIMICHI |
分类号 |
G01J5/10;H01L23/28;H01L23/48;H05K3/30;H05K5/00 |
主分类号 |
G01J5/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|