| 摘要 |
The present invention relates to a method for manufacturing a heat-dissipating substrate for an LED and to a structure thereof. The method for manufacturing a heat-dissipating substrate for an LED, having a heat-dissipating fin, comprises: a first step of preparing a printed circuit board; a second step of forming an insertion hole for inserting the heat-dissipating fin at a specific portion of the printed circuit board; a third step of applying a cream solder to or forming a soldering material film on a portion of an upper surface of the printed circuit board extending from the insertion hole, an inner surface of the insertion hole, and/or a portion of a lower surface of the printed circuit board extending from the insertion hole; a fourth step of inserting the heat-dissipating fin into the insertion hole such that at least a portion of the heat-dissipating fin contacts the portion at which the cream solder is applied or contacts the soldering material film; and a fifth step of heating the heat-dissipating fin to solder a portion of the contact area between the heat-dissipating fin and the printed circuit board. According to the present invention, the sealed contact between the heat-dissipating fin and the printed circuit board is ensured, and the printed circuit board is protected from moisture or gas. |
