| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for detecting a failure in a path between a data input/output pad and a test pad and a failure in a circuit in the middle of the path. SOLUTION: A micro-bump pad (a first pad 21) for data input/output is arranged in a connection path between the test pad (second pad 22) used for testing a semiconductor device and an internal circuit 23. Consequently, it is possible to detect a connection failure and a circuit failure of all the paths to the internal circuit 23 when executing a test using the second pad 22. COPYRIGHT: (C)2011,JPO&INPIT |
