| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board in which a metal conductor inside a groove for circuit formation is formed by a crystal of a uniform and microfabricated grain aggregate to have a higher reliability of a circuit. SOLUTION: On the surface of an insulating base material 1, a groove 2 for circuit formation is formed. Then, the inside the groove 2 for circuit formation is filled with a metal conductor 3 formed by plating, and the circuit board is formed. The crystal grain aggregate of the metal conductor has an average diameter length ≤10 μm, and the metal conductor 3 is formed of the crystal of the uniform and microfabricated grain aggregate. COPYRIGHT: (C)2011,JPO&INPIT |
