| 发明名称 |
METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
Disclosed is a method for manufacturing a film-like adhesive, wherein a film-like adhesive is formed by: forming an adhesive composition layer by applying, to a base material, an adhesive composition, which contains (A) a radiation polymerizable compound, (B) a photoinitiator, and (C) a thermosetting resin, and also 5 mass% or less of solvent, and which is in the liquid state at 25°C; and irradiating the adhesive composition layer with light. |
| 申请公布号 |
WO2011058999(A1) |
申请公布日期 |
2011.05.19 |
| 申请号 |
WO2010JP70019 |
申请日期 |
2010.11.10 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD.;MITSUKURA KAZUYUKI;KAWAMORI TAKASHI;MASUKO TAKASHI;KATOGI SHIGEKI;FUJII SHINJIRO |
发明人 |
MITSUKURA KAZUYUKI;KAWAMORI TAKASHI;MASUKO TAKASHI;KATOGI SHIGEKI;FUJII SHINJIRO |
| 分类号 |
H01L21/52;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L21/52 |
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