| 摘要 |
<P>PROBLEM TO BE SOLVED: To image alignment marks of a wafer stage and a mask stage by one imaging apparatus. <P>SOLUTION: A mask stage 18 has a mask stage mark 20 and supports a mask 16. A wafer stage 32 has a wafer stage mark 42 and supports a wafer 30. An imaging apparatus 48 is switched over a state that the mask stage mark 20 can be imaged and a state that the wafer stage mark 42 can be imaged. A controller 40 executes alignment based on the position information of the mask stage mark 20 and the position information of the wafer stage mark 42 imaged by the imaging apparatus 48. <P>COPYRIGHT: (C)2011,JPO&INPIT |
