发明名称 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a pattern forming method for forming a pattern having a large depth of focus (DOF), small line width roughness (LWR) and reduced bridge defects, in order to more stably form a high-accuracy fine pattern for manufacturing a highly integrated and accurate electronic device, and to provide a chemical amplification resist composition used in the method and a resist film formed from the chemical amplification resist composition. <P>SOLUTION: The pattern forming method includes: (1) a step of forming a film from a chemical amplification resist composition; (2) a step of exposing the film; and (3) a step of developing the film by using an organic solvent-containing developer, wherein the resist composition contains: (A) a resin substantially insoluble in alkali; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a cross-linking agent; and (D) a solvent. The chemical amplification resist composition used in the method and the resist film formed from the chemical amplification resist composition are also provided. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011100089(A) 申请公布日期 2011.05.19
申请号 JP20090285584 申请日期 2009.12.16
申请人 FUJIFILM CORP 发明人 ENOMOTO YUICHIRO;KAMIMURA SATOSHI;TARUYA SHINJI;KATO KEITA;IWATO KAORU
分类号 G03F7/038;C08F20/10;C08F32/08;G03F7/004;G03F7/32;H01L21/027 主分类号 G03F7/038
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