| 摘要 |
PROBLEM TO BE SOLVED: To provide an excellent method and apparatus for cleaning/drying a hydrophobic wafer. SOLUTION: This method and this apparatus that use a surfactant to clean a hydrophobic wafer is provided. In a first aspect, the method may clean and dry a wafer without supplying pure DI water to the wafer. In a second aspect, the method may clean a wafer by supplying pure DI water to the wafer only for a short duration of time such that the DI water supply ceases as soon as or before a surfactant solution is rinsed from the wafer, and thereafter the wafer is dried. In another aspect, a hydrophobic wafer is maintained wetted with surfactant while it is transferred between cleaning apparatuses, rinsed by diluted surfactant or by a brief DI water spray, and thereafter dried. COPYRIGHT: (C)2011,JPO&INPIT
|
