发明名称 THERMOSETTING CONDUCTIVE PASTE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive thermosetting conductive paste composition high in conductivity. SOLUTION: The thermosetting conductive paste composition includes (A) a silver powder, (B) a thermosetting component, and (C) a setting agent. (A) the silver powder is constituted of (a1) flake form silver powder and (a2) spherical silver powder. Polycarboxylic acid is adhered onto a surface of at least one of (a1) the flake form silver powder and (a2) the spherical silver powder and the ratio of (A) the silver powder in a solid content is 90-95 wt.%. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011100573(A) 申请公布日期 2011.05.19
申请号 JP20090253170 申请日期 2009.11.04
申请人 KYOTO ELEX KK 发明人 HINOTSU TAKASHI;OGI KOZO;NAKAYAMA YUTAKA
分类号 H01B1/22;B22F1/00;B22F1/02;H01B1/00;H05K1/09 主分类号 H01B1/22
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