发明名称 |
LEAD-FREE SOLDER CONNECTION STRUCTURE AND SOLDER BALL |
摘要 |
Solder used for flip chip bonding inside a semiconductor package was a Sn—Pb solder such as a Pb-5Sn composition. Lead-free solders which have been studied are hard and easily form intermetallic compounds with Sn, so they were not suitable for a flip chip connection structure inside a semiconductor package, which requires stress relaxation properties. This problem is eliminated by a flip chip connection structure inside a semiconductor package using a lead-free solder which is characterized by consisting essentially of 0.01-0.5 mass percent of Ni and a remainder of Sn. 0.3-0.9 mass percent of Cu and 0.001-0.01 mass percent of P may be added to this solder composition.
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申请公布号 |
US2011115084(A1) |
申请公布日期 |
2011.05.19 |
申请号 |
US20090736053 |
申请日期 |
2009.03.03 |
申请人 |
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发明人 |
UESHIMA MINORU;SUZUKI MASAYUKI;YAMANAKA YOSHIE;YOSHIKAWA SHUNSAKU;YAMAKI TOKURO;OHNISHI TSUKASA |
分类号 |
H01L23/488;C22C13/00;H01L21/60 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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