| 摘要 |
According to one embodiment, a wafer prober for conducting a backside analysis on a wafer is provided. The wafer prober includes a wafer stage and a movable plate. The wafer stage includes surface and back opposed in a thickness direction, a concave portion provided at the surface which supports the wafer, and a first through hole which passes through a bottom face of the concave portion in the thickness direction in the concave portion. The movable plate is accommodated in the concave portion of the wafer stage. The movable plate is movable in a direction parallel to a top face of the wafer stage. The movable plate has a thickness equivalent to a depth of the concave portion of the wafer stage. The movable plate has a second through hole. The second through hole passes through the movable plate in a thickness direction. The second through hole is smaller than the first through hole. The second through hole communicates with the first through hole.
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